Bhubaneswar: In a major boost to India’s semiconductor ambitions, Odisha is set to host the foundation laying ceremony of the country’s first advanced 3D glass-based semiconductor packaging unit on April 19 in Bhubaneswar.
The project, titled Heterogeneous Integration Packaging Solutions (3D Glass Solutions), marks a significant step towards positioning Odisha as a global hub for next-generation semiconductor manufacturing. According to the state government, the facility will introduce cutting-edge 3D heterogeneous integration technology and advanced glass substrate-based chip packaging for the first time in India.
The ceremony will be attended by Chief Minister Mohan Charan Majhi, Union Minister for Electronics and IT Ashwini Vaishnaw, and Odisha’s Electronics and IT Minister Mukesh Mahaling, along with senior government officials, global industry leaders, investors, and members of academia.
With an estimated investment of ₹1,943 crore, the project is expected to generate around 2,500 direct and indirect employment opportunities. It will have an annual production capacity of approximately 50 million assembled units, catering to high-demand sectors such as aerospace, defence, artificial intelligence, 5G technologies and data centres.
Officials said the project moved swiftly from approval to execution, reflecting a fast-track implementation approach. The unit is expected to play a crucial role in strengthening India’s semiconductor value chain, particularly in advanced packaging technologies, which are critical for modern electronics manufacturing.
This development further enhances Odisha’s growing semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on glass substrates.
The initiative aligns with the broader vision of “Atmanirbhar Bharat” and underscores the state government’s commitment to attracting high-tech investments, promoting innovation, and building a robust, future-ready industrial base.
Experts believe that the project will not only boost Odisha’s industrial profile but also place it prominently on the global semiconductor map, paving the way for further investments and technological advancements in the sector.
Key highlights of the project
- First in India: Establishment of the country’s first Glass substrate based AdvancedSemiconductor Packaging Unit in Odisha
- Cutting-edge Technology: Introduction of advanced 3D Heterogeneous Integration modules
- Rapid Progress: Groundbreaking within months of approval by the Union Cabinet, reflecting fast-track implementation
- Strategic Investment: Project outlay of approximately ₹1,943 crore
- Employment Generation: Creation of around 2,500 direct and indirect jobs
- High Capacity: Annual production capacity of 50 million assembled units
- Critical Applications: Chips to serve key sectors including aerospace, defence, artificial intelligence, 5G technologies and Data Centres.
This milestone further strengthens Odisha’s semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on Glass Substrates.
