UK-based corporation SRAM & MRAM Group intends to set up a huge semiconductor fabrication unit in the Ganjam district, Odisha. The first phase to establish this unit will be started with an initial investment of Rs 30,000 crore. The project’s total cost is estimated to be over Rs 2 lakh crore.
The UK-based SRAM & MRAM Group’s Indian division SRAM & MRAM Technologies and Projects India Pvt Limited inked a memorandum of understanding (MoU) with the state government to establish the semiconductor plant in Odisha. This MoU was signed on March 26, and now the officials from the company are on a field visit to decide upon the factory’s location in the Ganjam district.
On June 29, after inspecting certain sites in the district near Chhatrapur, its Indian firm representatives, led by its chairman Guruji Kumaran Swami, met with the district administration in Chhatrapur. The District Collector of Ganjam Dibya Jyoti Parida has informed the investors that the administration will provide all necessary facilities for the establishment of the semiconductor unit.
The company’s project director, Debadutt Singhdeo, said, “We have visited some sites, including the industrial park of Tata and some private lands for the establishment of the proposed semiconductor unit. A technical team of the company will visit the district to finalise the site”. The corporation will need up to 800 acres of land to build the unit.
Even though company representatives also travelled to other districts, they chose the location near Chhatrapur because it was close to the Gopalpur port, a designated industrial corridor, an airstrip, and a national highway, in addition to having access to clean water and energy, which are essential for the fabrication unit.
Singhdeo stated, “The company has aimed to establish the unit within two years and to provide direct employment to 5,000 people. It has also planned to expand the unit in subsequent phases by investing around Rs 2 lakh crore by 2027”.
This new facility in Odisha will boost India’s Semiconductor Mission. It will boost India’s ambition to become a global electronics manufacturing and design hub. In the manufacturing of modern electronics, semiconductors are critical components in it. From autos and medical equipment to smartphones and laptops, they are utilised in various products to make integrated circuits, memory modules, and microprocessors in these products.
Recently following the approval of the proposal of US-based chip-maker Micron to set up a 2.7 billion dollar semiconductor testing and packaging unit by the Government of India, the Gujarat government signed a pact with Micron on June 28 worth Rs 22,500 crore to set up an ATMP (assembly, test, marking, and packaging) facility at Sanand city, which comes under Ahmedabad district.
During the meeting of Micron with the Gujarat government, both stakeholders signed an MoU to establish an assembly and test facility at Sanand GIDC. The MoU was signed between the Secretary of the Department of Science and Technology, Vijay Nehra, and the Senior Vice President of Micron Gursharan Singh.
Vice Chairman and Managing Director, GIDC handed over the Offer Cum Allotment (OCA) letter to Micron for the allotment of 93 acres of area within the Sanand GIDC Estate. As per the release by the Gujrat government, Micron will establish Assembly and Test facility, which will focus on transforming wafers into ball grid array (BGA) integrated circuit packages, memory modules and solid-state drives.
Micron is committed to designing and building the facility to meet or exceed leadership in Energy and Environmental Design (LEED) Gold standards. Additionally, the facility will use advanced water-saving technologies to enable Zero Liquid Discharge (ZLD).