UP’s first semiconductor unit to break ground in January 2026
September 14, 2026
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Uttar Pradesh: UP’s first semiconductor unit to break ground in January 2026

Uttar Pradesh will witness the groundbreaking of its first semiconductor unit in January 2026, a Rs 3,706 crore HCL Foxconn joint venture in Jewar that will manufacture Display Driver Integrated Circuits (DDICs). The project marks a major step toward India’s semiconductor self-reliance and UP’s rise as a high-tech manufacturing hub

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Dec 24, 2025, 03:05 pm IST
inBharat, Technology, Uttar Pradesh
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UP’s first semiconductor unit to break ground in January 2026

UP’s first semiconductor unit to break ground in January 2026

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LUCKNOW:  In a major step towards India’s semiconductor self-reliance mission, Uttar Pradesh is set to witness the groundbreaking ceremony of its first semiconductor manufacturing unit in January 2026. The state’s debut facility, coming up through a joint venture between HCL and Foxconn, will be established in Sector 28 of the Jewar area, Gautam Budh Nagar. This will be a crucial milestone in India’s high-tech manufacturing journey.

The project involves an investment of Rs 3,706 crore and falls under the OSAT (Outsourced Semiconductor Assembly and Test) category. It will specialise in producing Display Driver Integrated Circuits (DDICs), a vital component that functions as the “brain” behind modern display technologies used in smartphones, televisions, personal computers, cars, and wearable devices such as smartwatches and smart glasses.

DDICs play a central role in driving innovations such as 4K and UHD resolutions, OLED and AMOLED displays, touch sensitivity, and foldable display technology. Currently, India relies heavily on imports of such chips, but once operational, the unit, with a production capacity of 20,000 silicon wafers per month, is expected to significantly reduce the country’s dependence on foreign manufacturers.

An industry expert said that the unit’s proximity to the national capital and its setup in Uttar Pradesh make it a project of great strategic importance for both the state and the country. It will serve as a major step toward building a self-reliant semiconductor ecosystem.”

Officials confirmed that the groundbreaking ceremony is planned for mid-January 2026, after which rapid construction will commence. The facility is being viewed as a cornerstone of semiconductor operations in Uttar Pradesh, aligning with both state and national goals to advance the electronics and manufacturing sectors.

HCL Group Chairperson Roshni Nadar Malhotra emphasised that the venture would bring global expertise, technological innovation, and skill development opportunities in the semiconductor domain. With its projected capacity, the facility will support the mass production of millions of microchips, meeting increasing domestic demand and boosting India’s standing in the global semiconductor value chain.

A state government spokesperson highlighted that the arrival of such a high-end manufacturing project reflects Uttar Pradesh’s investor-friendly policies and the state’s transformation into a prime investment destination. The initiative also aligns with Chief Minister Yogi Adityanath’s vision of turning UP into a trillion-dollar economy, supported by robust industrial infrastructure and global partnerships. Industry analysts believe the project will position Uttar Pradesh as a significant player in the global semiconductor value chain, connecting it directly to future technology trends and fostering a skilled workforce trained in advanced chip manufacturing.

Topics: FoxconnHCL Group Chairperson Roshni Nadar MalhotraGautam Budh NagarUttar PradeshYogi Adityanath
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