1st advanced 3D semiconductor packaging unit - Organiser

1st advanced 3D semiconductor packaging unit

CM Mohan Charan Majhi along with Union IT Minister Ashwini Vaishnaw during the ground-breaking ceremony of the Heterogeneous Integration Packaging Solutions (3DGS) project at Info Valley.

Odisha hosts groundbreaking India’s 1st advanced 3D semiconductor packaging unit; Major boost to AI, 5G & Defence Tech